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Design for Test and Test Optimization Techniques for TSV based 3D Stacked ICs

Brandon Noia

Design for Test and Test Optimization Techniques for TSV based 3D Stacked ICs - 2014 - Springer 2014

ISBN: 9783319023786

Subjects--Topical Terms:
Electronic Circuits and Systems
Engineering

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Central Library - Coimbatore

Design for Test and Test Optimization Techniques for TSV based 3D Stacked ICs