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3D Microelectronic Packaging

Yan Li

3D Microelectronic Packaging - 1st ed. 2017 - Springer 2017 - Springer Series in Advanced Microelectronics .

ISBN: 9783319445861

Subjects--Topical Terms:
Instrumentation
Electronics and Microelectronics
Engineering

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Central Library - Coimbatore

3D Microelectronic Packaging