Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free solder Joint Interfaces

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Computer fileSeries: springer ThesesPublication details: springer; 2016Edition: 1st ed. 2016ISBN:

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Item type	Home library	Collection	Status	Barcode
E-BOOKS	EBOOKS	TEXT BOOK	Not for loan	EBK2265

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Central Library - Coimbatore