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Chiplet Design and Heterogeneous Integration Packaging

By:

John H. Lau

Material type:

Computer file

Computer fileSeries: Lecture Notes in Mechanical EngineeringPublication details: Springer; 2023Edition: 2023ISBN:

9789811999178

Subject(s):

Online resources:

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Item type	Home library	Status	Barcode
E-BOOKS	EBOOKS	Not for loan	EBK10353

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