Electronic assembly fabrication chips, circuit boards, packages, and components
Material type:
TextSeries: Electronic packaging and interconnection seriesPublication details: New York; McGraw-Hill; 2002Description: xv, 671pISBN: - 71378820
| Item type | Home library | Collection | Call number | Status | Barcode | |
|---|---|---|---|---|---|---|
BOOKS
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AMRITA SCHOOL OF ENGINEERING | REFERENCE | 621.38.049 P21 (Browse shelf(Opens below)) | Not for loan | 24818 |
Includes bibliographical references and index.
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