Normal view MARC view ISBD view

The Hindu survey of Indian industry 2007

Contributor(s):

The Hindu

Material type: Text

TextPublication details: New Delhi; The Hindu; 2007Description: 352pSubject(s):

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings ( 3 )
Comments ( 0 )

Holdings
Item type	Home library	Call number	Status	Barcode
BOOKS	AMRITA SCHOOL OF ENGINEERING	338.45(540) N50; P7 (Browse shelf(Opens below))	Available	37636
BOOKS	AMRITA SCHOOL OF ENGINEERING	338.45(540) N50; P7;1 (Browse shelf(Opens below))	Available	37637
BOOKS	AMRITA SCHOOL OF ENGINEERING	338.45(540) N50;P7;2 (Browse shelf(Opens below))	Available	39301

There are no comments on this title.

to post a comment.

Back to results

81 Packaging Science and Technology
by De Chang Xi-Guo Qiang Cai-Zhen Lin Wang-De Gao
82 Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
by Bar-Cohen, Avram
83 Plastic Films in Food Packaging
by Sina Ebnesajjad
84 Innovations in Food Packaging
by Jung H. Han
85 Food Packaging and Food Alterations
by Parisi, Salvatore.
86 Lead-Free Solder: Interconnect Reliability
by Shangguan, Dongkai
87 The Political Economy of Trust
by Henry Farrell
88 Food Contact Materials
by Forrest, Martin J.
89 Hermeticity of Electronic Packages
by Hal Greenhouse
90 Additive Migration From Plastics Into Foods
by Crompton, T. R.
91 Coatings and Inks for Food Contact Materials
by Forrest, Martin John.-Rapra Technology Limited.
92 Regulation of Food Packaging in Europe and the U.S
by Knight, Derek J.-Creighton, Lesley A.-Rapra Technology Limited.
93 Assessing Food Safety of Polymer Packaging
by Vergnaud, J. M.-Rosca, Iosif-Daniel.
94 Rigid Plastics Packaging
by Hannay, Francis.-Rapra Technology Limited.
95 Food Contact Rubbers 2
by Forrest, Martin John.-Rapra Technology Limited.
96 Reflow Soldering Processes
by Ning-Cheng Lee
97 Innovations in Food Packaging
by Jung H. Han
98 Materials for High-Density Electronic Packaging and Interconnection
by National Research Council-Division on Engineering and Physical Sciences-National Materials Advisory Board-Commission on Engineering and Technical Systems-Committee on Materials for High-Density Electronic Packaging
99 Physical design essentials
by Golshan, Khosrow.

Central Library - Coimbatore

The Hindu survey of Indian industry 2007