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Thermal management handbook for electronic assemblies

By: Contributor(s): Material type: TextTextSeries: Electronic packaging and interconnection seriesPublication details: McGraw-Hill; New York; 1998Description: illISBN:
  • 70266999
Subject(s):
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Item type Home library Collection Call number Status Barcode
BOOKS BOOKS AMRITA SCHOOL OF ENGINEERING REFERENCE 621.38:536 N80 (Browse shelf(Opens below)) Not for loan 46087

Includes bibliographical references and index

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