TY  - DATA
AU  - John H   Lau
AU  -  Ning Cheng Lee
TI  - Assembly and Reliability of Lead Free Solder Joints
SN  - 9789811539206
PB  - springer
KW  -  Instrumentation
KW  - Electronics and Microelectronics
KW  - Engineering
UR  - https://link.springer.com/openurl?genre=book&isbn=978-981-15-3920-6
ER  -