Yan Li <br/><br/>
3D Microelectronic Packaging 

 - Second Edition 2021 
 -  springer  2021 
 - Springer Series in Advanced Microelectronics .
<br/><br/><label>ISBN: </label>9789811570902 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic Circuits and Systems<br/>Engineering