TY  - DATA
AU  - Yan Li
AU  -  Deepak Goyal
TI  - 3D Microelectronic Packaging
T2  - Springer Series in Advanced Microelectronics
SN  - 9789811570902
PB  - springer
KW  - Electronic Circuits and Systems
KW  - Engineering
UR  - https://link.springer.com/openurl?genre=book&isbn=978-981-15-7090-2
ER  -