TY  - DATA
AU  - John H   Lau
TI  - Semiconductor Advanced Packaging
SN  - 9789811613760
PB  - springer
KW  -  Instrumentation
KW  - Electronics and Microelectronics
KW  - Engineering
UR  - https://link.springer.com/openurl?genre=book&isbn=978-981-16-1376-0
ER  -