John H. Lau <br/><br/>
Chiplet Design and Heterogeneous Integration Packaging 

 - 2023 
 -  Springer  2023 
 - Lecture Notes in Mechanical Engineering .
<br/><br/><label>ISBN: </label>9789811999178 
<br/><br/><label>Subjects--Topical Terms: </label><br/> Instrumentation<br/>Electronics and Microelectronics<br/>Engineering