Chong Leong <br/><br/>
Interconnect Reliability in Advanced Memory Device Packaging 

 - 2023 
 -  Springer  2023 
 - "Smart Innovation, Systems and Technologies" .
<br/><br/><label>ISBN: </label>9783031267086 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering<br/>Hardware Performance and Reliability