John H. Lau <br/><br/>
"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology" 

 - 2024 
 -  Springer  2024 
 - Lecture Notes in Management and Industrial Engineering .
<br/><br/><label>ISBN: </label>9789819721405 
<br/><br/><label>Subjects--Topical Terms: </label><br/> Instrumentation<br/>Electronics and Microelectronics<br/>Engineering