TY  - DATA
AU  - John H. Lau
TI  - "Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology"
T2  - Lecture Notes in Management and Industrial Engineering
SN  - 9789819721405
PB  - Springer
KW  -  Instrumentation
KW  - Electronics and Microelectronics
KW  - Engineering
UR  - https://link.springer.com/openurl?genre=book&isbn=978-981-97-2140-5
ER  -