John Lau <br/><br/>
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration 

 - 2025 
 -  Springer Nature Singapore  2025 
<br/><br/><label>ISBN: </label>9789819641666 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering