TY  - DATA
AU  - John Lau
AU  - Xuejun Fan
TI  - Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
SN  - 9789819641666
PB  - Springer Nature Singapore
KW  - Engineering
UR  - https://link.springer.com/openurl?genre=book&isbn=978-981-96-4166-6
ER  -