Ken Kuang <br/><br/>
RF and Microwave Microelectronics Packaging II 

 - 1st ed. 2017 
 -  Springer  2017 
<br/><br/><label>ISBN: </label>9783319516974 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronics and Microelectronics<br/>Engineering<br/>Instrumentation