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Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology

By:

Yongle Wu

Contributor(s):

Weimin Wang

Material type:

Computer file

Computer fileSeries: Internet of ThingsPublication details: Springer; 2023Edition: 2023ISBN:

9789819914555

Subject(s):

Online resources:

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Holdings
Item type	Home library	Status	Barcode
E-BOOKS	EBOOKS-SPRINGER	Not for loan	EBK10507

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