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1.		The handbook of machine soldering SMT and TH by Woodgate, Ralph Edition: 3 Material type: Text Publication details: New York ; John Wiley ; 1996 Availability: Items available for reference: AMRITA SCHOOL OF ENGINEERING: Not for loan (1)Location, call number: RF16-R4 621.791.35(035) N6. Save to lists Add to cart (remove)
2.		The electronic packaging handbook by Blackwell, Glenn R, Ed Series: Electronics handbook series Material type: Text Publication details: Boca Raton ; CRC Press ; 2000 Availability: Items available for reference: AMRITA SCHOOL OF ENGINEERING: Not for loan (1)Location, call number: RF14-R3 621.38.049(035) P00. Save to lists Add to cart (remove)
3.		Surface mount technology for concurrent engineering and manufacturing feature extraction and computational intelligence by Classon, Frank Series: Electronic packaging and interconnection series Material type: Text Publication details: New York ; Mcgraw-Hill ; 1993 Availability: Items available for reference: AMRITA SCHOOL OF ENGINEERING: Not for loan (1)Location, call number: RF60-R4 621.791 N32. Save to lists Add to cart (remove)
4.		Advances in thermal modeling of electronic components and systems - vol. 3 by Bar-Cohen, Avram ed Kraus, Allan ed Material type: Text Publication details: New York ; ASME/IEEE ; 1993 Availability: Items available for loan: AMRITA SCHOOL OF ENGINEERING (1)Location, call number: C17-R3 621.382 N34.3. Place hold Save to lists Add to cart (remove)
5.	Image from Amazon.com	Heat transfer : thermal management of electronics by Younes shabany Material type: Text Publication details: Boca Raton ; CRC Press ; 2010 Availability: Items available for loan: AMRITA SCHOOL OF ENGINEERING (1)Location, call number: B32-R3 621.181.23 Q02;1. Place hold Save to lists Add to cart (remove)
6.	Image from Amazon.com	Heat transfer : thermal management of electronics by Younes Shabany Material type: Text Publication details: Boca Raton ; CRC Press ; 2010 Availability: Items available for loan: AMRITA SCHOOL OF ENGINEERING (1)Location, call number: B32-R3 621.181.23 Q02. Place hold Save to lists Add to cart (remove)
7.	Image from Amazon.com	Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging by Wei, Xing - Chang Material type: Text Publication details: Boca Raton ; CRC Press ; 2017 Availability: Items available for reference: AMRITA SCHOOL OF ENGINEERING: Not for loan (1)Location, call number: RF50-R1 621.3.049.75 Q70. Save to lists Add to cart (remove)