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1.	Image from Amazon.com	Area array packaging handbook manufacturing and assembly by Gilleo, Ken, Ed Material type: Text Publication details: New York ; McGraw-Hill ; 2002 Availability: Items available for reference: AMRITA SCHOOL OF ENGINEERING: Not for loan (1)Location, call number: RF14-R4 621.382(035) P2. Save to lists Add to cart (remove)
2.	Image from Amazon.com	Microwave and Millimeter-Wave Electronic Packaging by Sturdivant, Rick Series: Artech House Microwave Library Material type: Computer file; Format: electronic Language: English Publication details: Artech House ; 2014 Online resources: Click here to access online Availability: Items available for reference: EBOOKS-EBSCO ACADEMIC COLLECTION: Not for loan (1). Save to lists Add to cart (remove)
3.	Image from Amazon.com	Components, Packaging and Manufacturing Technology II by A. Wu Series: Applied Mechanics and Materials Material type: Computer file; Format: electronic Language: English Publication details: Trans Tech Publications Ltd ; 2014 Online resources: Click here to access online Availability: Items available for reference: EBOOKS-EBSCO ACADEMIC COLLECTION: Not for loan (1). Save to lists Add to cart (remove)
4.	Image from Amazon.com	Components, Packaging and Manufacturing Technology by Yanwen Wu Series: Key Engineering Materials Material type: Computer file; Format: electronic Language: English Publication details: Trans Tech Publications Ltd ; 2011 Online resources: Click here to access online Availability: Items available for reference: EBOOKS-EBSCO ACADEMIC COLLECTION: Not for loan (1). Save to lists Add to cart (remove)
5.	Image from Amazon.com	Lead-Free Solder: Interconnect Reliability by Shangguan, Dongkai Material type: Computer file; Format: electronic Language: English Publication details: ASM International ; 2005 Online resources: Click here to access online Availability: Items available for reference: EBOOKS-EBSCO ACADEMIC COLLECTION: Not for loan (1). Save to lists Add to cart (remove)
6.	Image from Amazon.com	Physical design essentials an ASIC design implementation perspective [EBOOK] by Golshan, Khosrow Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : Springer, c2007 Online resources: Click here to online access Availability: Items available for reference: EBOOKS-DIGITAL LIBRARY: Not for loan (1). Save to lists Add to cart (remove)