| 000 | 00726nmm a2200241Ia 4500 | ||
|---|---|---|---|
| 001 | EBK3057 | ||
| 005 | 20250328121306.0 | ||
| 008 | 250328s9999 xx 000 0 und d | ||
| 020 | _a9784431547952 | ||
| 100 | _aSeiji Samukawa | ||
| 245 | 0 | _aFeature Profile Evolution in Plasma Processing Using On wafer Monitoring System | |
| 250 | _a2014 | ||
| 260 | _bSpringer | ||
| 260 | _c2014 | ||
| 490 | _aSpringerBriefs in Applied Sciences and Technology | ||
| 650 | _aEngineering | ||
| 650 | _aMicrosystems and MEMS | ||
| 700 | _a Srikanta Patnaik | ||
| 700 | _a Zhengtao Yu | ||
| 856 | _3Click here to access online | ||
| 856 | _uhttps://link.springer.com/openurl?genre=book&isbn=978-4-431-54795-2 | ||
| 942 | _cEBK | ||
| 999 |
_c145062 _d145062 |
||