| 000 | 00635nmm a2200217Ia 4500 | ||
|---|---|---|---|
| 001 | EBK4783 | ||
| 005 | 20250328121343.0 | ||
| 008 | 250328s9999 xx 000 0 und d | ||
| 020 | _a9783319023786 | ||
| 100 | _aBrandon Noia | ||
| 245 | 0 | _aDesign for Test and Test Optimization Techniques for TSV based 3D Stacked ICs | |
| 250 | _a2014 | ||
| 260 | _bSpringer | ||
| 260 | _c2014 | ||
| 650 | _aElectronic Circuits and Systems | ||
| 650 | _aEngineering | ||
| 700 | _a Zhanna Anikina | ||
| 856 | _3Click here to access online | ||
| 856 | _uhttps://link.springer.com/openurl?genre=book&isbn=978-3-319-02378-6 | ||
| 942 | _cEBK | ||
| 999 |
_c146788 _d146788 |
||