| 000 | 00643nmm a2200229Ia 4500 | ||
|---|---|---|---|
| 001 | EBK7657 | ||
| 005 | 20250328123703.0 | ||
| 008 | 250328s9999 xx 000 0 und d | ||
| 020 | _a9789811539206 | ||
| 100 | _aJohn H Lau | ||
| 245 | 0 | _aAssembly and Reliability of Lead Free Solder Joints | |
| 250 | _a2020 | ||
| 260 | _bspringer | ||
| 260 | _c2020 | ||
| 650 | _a Instrumentation | ||
| 650 | _aElectronics and Microelectronics | ||
| 650 | _aEngineering | ||
| 700 | _a Ning Cheng Lee | ||
| 856 | _3Click here to access online | ||
| 856 | _uhttps://link.springer.com/openurl?genre=book&isbn=978-981-15-3920-6 | ||
| 942 | _cEBK | ||
| 999 |
_c149662 _d149662 |
||