| 000 | 00670nmm a2200229Ia 4500 | ||
|---|---|---|---|
| 001 | EBK10353 | ||
| 005 | 20250328143907.0 | ||
| 008 | 250328s9999 xx 000 0 und d | ||
| 020 | _a9789811999178 | ||
| 100 | _aJohn H. Lau | ||
| 245 | 0 | _aChiplet Design and Heterogeneous Integration Packaging | |
| 250 | _a2023 | ||
| 260 | _bSpringer | ||
| 260 | _c2023 | ||
| 490 | _aLecture Notes in Mechanical Engineering | ||
| 650 | _a Instrumentation | ||
| 650 | _aElectronics and Microelectronics | ||
| 650 | _aEngineering | ||
| 856 | _3Click here to access online | ||
| 856 | _uhttps://link.springer.com/openurl?genre=book&isbn=978-981-19-9917-8 | ||
| 942 | _cEBK | ||
| 999 |
_c158358 _d158358 |
||