| 000 | 00717nmm a2200241Ia 4500 | ||
|---|---|---|---|
| 001 | EBK10507 | ||
| 005 | 20250328143910.0 | ||
| 008 | 250328s9999 xx 000 0 und d | ||
| 020 | _a9789819914555 | ||
| 100 | _aYongle Wu | ||
| 245 | 0 | _aMicrowave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology | |
| 250 | _a2023 | ||
| 260 | _bSpringer | ||
| 260 | _c2023 | ||
| 490 | _aInternet of Things | ||
| 650 | _a RF Engineering and Optical Communications | ||
| 650 | _aEngineering | ||
| 650 | _aMicrowaves | ||
| 700 | _a Weimin Wang | ||
| 856 | _3Click here to access online | ||
| 856 | _uhttps://link.springer.com/openurl?genre=book&isbn=978-981-99-1455-5 | ||
| 942 | _cEBK | ||
| 999 |
_c158512 _d158512 |
||