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3D Microelectronic Packaging

By:

Yan Li

Contributor(s):

Gennady Mishuris

Material type:

Computer file

Computer fileSeries: Springer Series in Advanced MicroelectronicsPublication details: Springer; 2017Edition: 1st ed. 2017ISBN:

9783319445861

Subject(s):

Online resources:

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Holdings
Item type	Home library	Status
E-BOOKS	EBOOKS	Not for loan

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