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"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology"

John H. Lau

"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology" - 2024 - Springer 2024 - Lecture Notes in Management and Industrial Engineering .

ISBN: 9789819721405

Subjects--Topical Terms:
Instrumentation
Electronics and Microelectronics
Engineering

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Central Library - Coimbatore

"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology"