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"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology"

By:

John H. Lau

Material type:

Computer file

Computer fileSeries: Lecture Notes in Management and Industrial EngineeringPublication details: Springer; 2024Edition: 2024ISBN:

9789819721405

Subject(s):

Online resources:

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Item type	Home library	Status	Barcode
E-BOOKS	EBOOKS	Not for loan	EBK11472

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